Material Concept, Inc.—Introducing the World's First Copper Paste

*World’s first mass-producible copper paste for forming wires and electrodes for solar cells and electronic equipment.

Cu Paste
2016.10
Received 350 million JPY in funding (including capital reserve) from Fidele Partners Inc., Daiwa Corporate Investment Co., Ltd. and 31VENTURES Global Innovation Fund 1(*).
(*)Corporate venture capital fund formed by Mitsui Fudosan and Global Brain Corporation.
2016.9
Selected for Strategic Core Technology Advancement Program (Supporting Industry Program)
2016.8
Exhibited at NEDO Forum 2016 in Tohoku
2015.12
Exhibited at Tohoku University Innovation Fair 2015
2015.12
Selected for Innovation Commercialization Venture Support Project 2015 by New Energy and Industrial Technology Development Organization (NEDO)
Changing the future by switching from silver to copper.